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Research Article | Open Access
Volume 3 | Issue 11 | Year 2016 | Article Id. IJEEE-V3I11P105 | DOI : https://doi.org/10.14445/23488379/IJEEE-V3I11P105

Performance Analysis of Rectangular Patch Antenna using variation in Width of Conducting Patch

Sudarshan Kumar Jain

Citation :

Sudarshan Kumar Jain, "Performance Analysis of Rectangular Patch Antenna using variation in Width of Conducting Patch," International Journal of Electrical and Electronics Engineering, vol. 3, no. 11, pp. 25-30, 2016. Crossref, https://doi.org/10.14445/23488379/IJEEE-V3I11P105

Abstract

A microstrip rectangular patch antenna using different width of the conducting patch is analysed for the various characteristics of the antenna. The antenna is designed at a resonant frequency of 5 GHz. The dielectric substrate used for designed antenna is duroid having a dielectric permittivity of 2.2. It is observed that the gain of the designed antenna gain is enhanced when the width of the patch is reduced. The return loss of the antenna also changes. VSWR of the designed antenna is below 2 .In the designed antenna microstrip feeding is used to energize the antenna. The antenna is observed for the different characteristics such as gain, bandwidth, directivity return loss, and voltage standing wave ratio for different values of the patch width. High Frequency Structure Simulator (HFSS) software is used for the designing and simulation of the antenna.

Keywords

Microstrip antenna, bandwidth, patch size, voltage standing wave ratio, return los

References

[1] Constantine A. Balanis, Antenna Theory, Analysis and Design,3rd edition, A John Wiley & Sons, Inc. , Publication, 2005.
[2] Zhu Yongxiang, Chen Jianjun, SongXuerui, Cao Hongxi, “The Design Study of the Wide Bandwidth and High Gain RFID Microstrip Patch Antenna”, Third IEEE International Conference on Intelligent System Design and Engineering Applications-2013.
[3] Sudarshan Kumar Jain, “Design and analysis of rectangular microstrip antenna using slotted substrate structure to minimize fabrication” International Journal of Engineering Trends and Technology, volume 9, 2014